Semiconductor Process Development Engineer - Die Fab Operation

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Semiconductor Process Development Engineers at HFTC are responsible for advanced process development and sustaining of custom, cutting edge, micro and nano-fabrication technologies for high performance microwave and millimeter-wave applications. The technologies include InP and GaAs-based HBTs, HEMTs, diodes, and other electronic components which enable key competitive differentiation of Keysight's industry-leading RF, microwave and high bit rate instruments.

The focus of this position is on advanced high frequency packaging development as well as Die Fab & Backside processes for current and future MMIC products. These processes include heterogeneous integration of high frequency components, MMIC wafer thinning, wafer separation, dicing, chip sort, visual inspection, and outgoing quality. Responsibilities include but are not limited to the following:

• Driving heterogeneous integration development projects that are critical to Keysight's high frequency packaging roadmap
• Ownership of Die Fab processes and equipment to drive production sustaining and R&D activities.
• Work closely with other process, integration, product, and circuit design engineers to define process and device performance targets
• Define process flows, develop new fabrication processes and drive continuous process improvement (CPI) efforts to maximize product yield
• Ensure successful transfer and maintenance of new technologies in manufacturing. Project objectives will encompass performance, reliability and manufacturing goals.
• Work with Operations Group to implement robust process control; diagnose and resolve process problems
• Lead capital equipment acquisition projects that include tool evaluation, characterization, process development, and qualification.

• B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or equivalent experience.
• Previous experience in the following areas is highly desired: Heterogeneous integration and advanced packaging & assembly techniques, MMIC wafer thinning and Die Fab operations such as laser separation, saw separation, chip sort, auto-visual, and other backend processes.
• 3 years of experience in advanced semiconductor processes and devices is required and specific skills in III-V semiconductor processing is highly preferred.
• Experience with statistical process control and design of experiments is required.
• Candidates must have strong problem-solving and analytical skills, as well as excellent interpersonal and communication skills for successful inter and intra-group interactions.
• Must have strong self-initiative and proactive attitude

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***Keysight is an Equal Opportunity Employer.***

Keysight Technologies Inc. is an equal opportunity employer. Qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, protected veteran status, disability or any other protected categories under all applicable laws.

The level of role will be based on applicable experience, education and skills; Most offers will be between the minimum and the midpoint of the Salary Range listed below.

California Pay range: MIN $119,610.00 - MAX $199,340.00

Note: For other locations, pay ranges will vary by region

This role is eligible for Keysight Results Bonus Program

US Employees may be eligible for the following benefits:

• Medical, dental and vision
• Health Savings Account
• Health Care and Dependent Care Flexible Spending Accounts
• Life, Accident, Disability insurance
• Business Travel Accident and Business Travel Health
• 401(k) Plan
• Flexible Time Off, Paid Holidays
• Paid Family Leave
• Discounts, Perks
• Tuition Reimbursement
• Adoption Assistance
• ESPP (Employee Stock Purchase Plan)