Microelectronics Numerical Analysis Engineer

The application window is expected to close on: 08/01/2025.

Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.

Meet the Team

Join our high-impact Systems & Optics (SaO) team within Cisco's Common Hardware Group (CHG), providing essential support across key verticals including SP Routing, Enterprise Routing, and Switching. Our team is a foundational partner across CHG-driving innovation, advancing design reliability, and enabling scalable hardware solutions that power Cisco's most critical products.

Your Impact

You will help shape next-generation package, board, and system technologies by driving advanced simulation, experimental validation, and cross-functional optimization. Working closely with Silicon Design, Supply Chain, and Electrical Design teams, your contributions will directly influence reliability, performance, and manufacturability across programs-while also supporting long-term technology roadmaps and industry leadership. Specific responsibilities include:

• Develop and apply novel simulation and experimental methods to enable and optimize advanced hardware technologies. This includes scalable multiphysics models to predict system-level performance, reliability, and manufacturability (e.g., solder joint reliability, warpage, SMT defects, TIM behavior).
• Design and execute DOEs/test vehicles and computational analyses to establish design guidelines and optimize material, geometry, and architecture.
• Evaluate tradeoffs across performance, reliability, and manufacturability using modeling and analysis.
• Define failure limits and reliability testing requirements through both physical validation and accelerated testing models.
• Collaborate with academia and industry partners; contribute to standards bodies, conferences, IP development, and peer-reviewed publications.
  
  

Minimum Qualifications

• MS or PhD in Mechanical Engineering, Civil Engineering, Solid Mechanics, or Materials Science.
• 8+ years of experience in numerical analysis (e.g., FEA, CFD, coupled field analysis) and advanced packaging technology development.
• Strong background in mechanical design, reliability, and simulation of complex packaging structures, with a deep understanding of component- and board-level failure modes (e.g., warpage, CTE mismatch, delamination, fatigue).
• Proficiency in advanced simulation tools such as ANSYS Mechanical, Multiphysics, and Flotherm, with a track record of validating models through experimental methods.
• Demonstrated expertise in reliability testing, lifetime prediction methodologies, and characterization of real-world use conditions.

Preferred Qualifications

• Experience with 2.5D/3D advanced packaging, heterogeneous integration, and emerging microelectronics technologies.
• Knowledge of JEDEC or IPC standards related to reliability and thermal/mechanical testing.
• Track record of contributions to patents, publications, or industry standards in the field of packaging reliability or numerical analysis.
• Strong cross-functional collaboration skills with experience working closely with design, manufacturing, and research teams.
  
  

Why Cisco?

At Cisco, we're revolutionizing how data and infrastructure connect and protect organizations in the AI era - and beyond. We've been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint. Simply put - we power the future.

Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you'll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.